SE4485 Power Module Heat Dissipation and Thermal Conductivity

DOWSIL™SE 4485

Single-component, white, moisture-curing, thermally conductive silicone adhesive

Features and Benefits: • Single-component material • Semi-flowable • Fast skin-over time • Good adhesion • Thermally conductive • UL 94 V-0 certified

Composition: • Thermally conductive filler • Polydimethylsiloxane adhesive

Applications:

DOWSIL SE 4485 thermally conductive adhesive is designed to effectively transfer heat to cool electronic modules, including lighting fixtures, communication, and power supply equipment.

Description

Single-component RTV curing thermal material cures under moisture conditions, producing a durable, relatively low-stress elastomer with non-corrosive byproducts. The design of electronic devices continues to advance toward higher performance. Especially in the field of consumer electronics, there is a constant pursuit of thinner and more compact designs. Combined, these factors generally mean higher heat generation within devices. Thermal management of electronic devices is a primary consideration for design engineers. Devices operate more efficiently at lower temperatures and offer greater reliability throughout their service life. Therefore, thermally conductive composite materials play an indispensable role. Thermal materials act as a "bridge" for heat, transferring heat from the source (device) through the thermal medium (heat sink) to the surrounding environment. These materials possess properties such as low thermal resistance, high thermal conductivity, and a thin bond line thickness (BLT), which facilitate heat dissipation. Like all moisture-curing silicones, this product can be used for shallow potting and spot protection of leads or other components.

Application Methods • Manual or automated dispensing

Effective Temperature Range

In most applications, silicone adhesives should perform long-term within a temperature range of -45 to 200°C (-49 to 392°F). However, at the upper and lower limits of this range, the behavior and performance of the material in specific applications become more complex and require careful consideration. For low-temperature performance, most products can withstand thermal cycling conditions such as -55°C (-67°F), but the performance of components and assemblies should be verified. Factors that may affect performance include the structure and stress sensitivity of the assembly, cooling rate and dwell time, as well as previous temperature exposure.